Intel’s Heat Challenges: Why Apple’s iPhone Processors Are Unlikely to Be Made by Intel
Recent discussions have emerged regarding the potential collaboration between Apple and Intel for future iPhone processors. Reports suggested that Apple was evaluating Intel’s latest chip manufacturing processes, leading to speculation about a possible shift from TSMC to Intel for certain components. However, industry experts have cast significant doubt on this prospect, primarily due to thermal management issues associated with Intel’s advanced chip nodes.
Apple’s Exploration of Intel’s 18A Process
According to a report by DigiTimes, Apple has been in talks with Intel to assess the viability of its 18A process for upcoming products. The discussions reportedly focus on utilizing Intel’s 18A process for the lower-end M series chips slated for release in 2027. Additionally, there is consideration for employing the same process in non-Pro iPhone models by 2028. GF Securities further indicated that Apple’s custom ASIC, also planned for 2028, is expected to incorporate Intel’s Embedded Multi-die Interconnect Bridge (EMIB) packaging technology.
To facilitate this evaluation, Intel has signed a non-disclosure agreement (NDA) with Apple and provided 18A process design kits for testing. Notably, Intel’s 18A process is the first to support Foveros Direct 3D hybrid bonding, a technique that enables the stacking of chiplets, potentially enhancing performance and efficiency.
Thermal Management Concerns with Intel’s Advanced Nodes
Despite these developments, industry insiders have expressed skepticism about Intel’s suitability for manufacturing iPhone processors. A significant concern revolves around Intel’s implementation of Backside Power Delivery (BSPD), branded as PowerVia, in its 18A and 14A nodes. While BSPD can improve power delivery and boost performance, it also leads to increased heat generation—a critical issue for mobile devices like the iPhone, which rely on air cooling and have stringent thermal constraints.
A discussion on the SemiWiki forum highlighted these challenges. User IanD explained that BSPD necessitates maintaining the heatsink approximately 20°C cooler to achieve the same die temperature in hotspots. This requirement is often unfeasible in scenarios dependent on air cooling or with maximum allowable case temperatures, such as in smartphones.
Further emphasizing the thermal issues, user Jukan noted that implementing BSPD involves specific process steps during wafer flipping, which significantly degrade thermal dissipation performance. This degradation poses a substantial hurdle for integrating Intel’s advanced nodes into mobile devices.
Implications for Apple’s Processor Manufacturing Strategy
Given these thermal management challenges, experts assert that there is minimal likelihood of Intel producing processors for Apple’s iPhones. While Intel’s advanced manufacturing processes offer certain advantages, the associated heat generation makes them unsuitable for mobile applications where efficient thermal management is paramount.
However, Intel may still have opportunities to manufacture Apple’s lower-end M series chips, where thermal constraints are less stringent compared to mobile devices. This potential collaboration would allow Apple to diversify its supply chain and reduce reliance on a single manufacturer, aligning with its broader strategic objectives.
Conclusion
In summary, while Apple has explored the possibility of utilizing Intel’s advanced chip manufacturing processes for future products, significant thermal management issues associated with these processes render them impractical for iPhone processors. Consequently, industry experts maintain that the chances of Intel producing Apple’s iPhone processors are virtually nonexistent. Nonetheless, Intel may still play a role in manufacturing certain lower-end M series chips, contributing to Apple’s efforts to diversify its supply chain and enhance production resilience.
